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    Home - Featured - Xiaomi 18 Fold with Xring O3 Chip Launching on September 7: Xiaomi Pad 9 Pro Max Could Tag Along
    Featured

    Xiaomi 18 Fold with Xring O3 Chip Launching on September 7: Xiaomi Pad 9 Pro Max Could Tag Along

    KavishBy KavishSeptember 2, 2026No Comments3 Mins Read
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    Xiaomi 18 Fold with Xring O3 Chip Launching on September 7: Xiaomi Pad 9 Pro Max Could Tag Along
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    oi
    -Carlsen Martin


    Published: Wednesday, September 2, 2026, 11:59 [IST]

    Xiaomi is preparing for a major product launch in China on September 7, where the company is expected to unveil two premium devices powered by its latest in-house chipset. The Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max are both set to feature the new Xring O3 processor, highlighting Xiaomi’s growing push to use its own silicon across flagship smartphones and tablets.

    The Xiaomi autumn launch event is scheduled to begin at 7pm local time in China. Alongside the new mobile devices, Xiaomi is also expected to showcase new electric vehicles under its Pengcheng brand. However, the debut of the Xring O3 across two high-end products is likely to be the biggest technology highlight of the event.

    Xiaomi 18 Fold with Xring O3 Chip Launching on September 7

    Table of Contents

    Toggle
    • Xiaomi 18 Fold to Debut With Xring O3
    • Xring O3 Specifications and Performance
    • Xiaomi Pad 9 Pro Max Could Pack 10,000mAh+ Battery
    • Xiaomi’s Xring O3 Strategy Goes Beyond Smartphones

    Xiaomi 18 Fold to Debut With Xring O3

    The Xiaomi 18 Fold is expected to become the first smartphone powered by the Xring O3 chipset. The foldable is also tipped to feature an inward-folding design with a wider aspect ratio.

    The wider form factor could offer a more practical experience for typing, multitasking and watching videos compared with some of the narrower book-style foldable smartphones currently available.

    The Xiaomi 18 Fold is also expected to pair the Xring O3 processor with LPDDR6 RAM from ChangXin Memory Technologies. The combination would bring two key Chinese-developed hardware components together in a premium consumer device.

    Xring O3 Specifications and Performance

    The Xring O3 is reportedly manufactured using a 3nm process and features a 10-core all-large-core CPU architecture. Xiaomi claims the processor can reach a peak clock speed of 4.35GHz and is equipped with a 16-core G2-Ultra NX GPU.

    According to Xiaomi, the new chipset delivers up to 85 per cent higher graphics performance while reducing power consumption by up to 64 per cent compared with its predecessor.

    Xiaomi Pad 9 Pro Max Could Pack 10,000mAh+ Battery

    The Xiaomi Pad 9 Pro Max will also be powered by the Xring O3, making it the second major device at the event to showcase Xiaomi’s latest flagship silicon.

    A Geekbench listing for the tablet, identified by model number M367FC, reportedly recorded 3,710 points in single-core testing and 14,319 points in multi-core testing. These numbers suggest that Xiaomi is targeting users who need more performance than a conventional entertainment-focused tablet.

    The Xiaomi Pad 9 Pro Max is also expected to feature a battery larger than 10,000mAh, paired with support for 120W wired fast charging. Alongside its large display and flagship processor, the tablet could appeal to professionals and power users involved in video editing, digital art, multitasking and other demanding workloads.

    Xiaomi’s Xring O3 Strategy Goes Beyond Smartphones

    The September 7 launch is significant for Xiaomi beyond the two products themselves. By bringing the Xring O3 to both a flagship foldable smartphone and a high-end tablet, Xiaomi is effectively testing whether its in-house silicon can compete in the premium mobile segment.

    While benchmark performance remains important, the success of the Xring O3 will ultimately depend on factors such as sustained performance, battery efficiency, thermal management and software optimisation. The Xiaomi 18 Fold and Pad 9 Pro Max will therefore provide an early indication of how far the company can take its strategy of developing more of its core hardware in-house.

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